Two pics up. One showing the SMT site half wetted with what looks like normal gold considering the thousands or so I've seen. Never had this problem before but for black pad. This ain't that, of course. This situation is not in any way related to thermal plane connections. The through hole stuff looks a little flakey. Don't know about the thermal connections but possible though contamination is my first guess. Did the solder paste print and reflow sample and it looked acceptable. Design sucks but did not interfere, so far, with solderability. Anxiously awaiting final product/solder joint quality. Keep you all posted. Kathy, did you get my ramblings about management worker stuff? MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------