Tony,

This is a subject always needing attention, in my not so humble opinion but
objective study and observation. As Daan said, fids can be off. This also
means other pads can be off on boards especially multiple ups. The Gerber is
one thing to a board going through all "normal" process and quite another to
stencils with very high dimensional stability.

Anyway, matching the stencil to the board pads/fids is easily done on the
printer. Also, printing a miylar over the panels before committing to
production works as well - ESD safe material of course.

Love those DEKS as you can press F2, I think, and have the rising table rise
so solder paste can be applied. At this time you can observe stencil to pad
registration so you only see metal instead of green as the board.

Hell, you folks all know this,

MoonMan

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