Tony, This is a subject always needing attention, in my not so humble opinion but objective study and observation. As Daan said, fids can be off. This also means other pads can be off on boards especially multiple ups. The Gerber is one thing to a board going through all "normal" process and quite another to stencils with very high dimensional stability. Anyway, matching the stencil to the board pads/fids is easily done on the printer. Also, printing a miylar over the panels before committing to production works as well - ESD safe material of course. Love those DEKS as you can press F2, I think, and have the rising table rise so solder paste can be applied. At this time you can observe stencil to pad registration so you only see metal instead of green as the board. Hell, you folks all know this, MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------