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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 11 Mar 2002 08:32:43 -0600 |
Content-Type: | text/plain |
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Dave,
I do appreciate the input. I need to clarify that the solder mask was
applied over bare copper and the subsequent gold "coating" process seems to
have been effected properly. I mean, the gold appears as gold should or has
always looked to me and solder mask contamination could not have been a
factor as, again, it was applied and stripped over bare copper before ENIG.
I sure appreciate the suggestion about FTIR. I'll employ the analysis
process ASAP.
Enjoy,
MoonMan
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