Dave, I do appreciate the input. I need to clarify that the solder mask was applied over bare copper and the subsequent gold "coating" process seems to have been effected properly. I mean, the gold appears as gold should or has always looked to me and solder mask contamination could not have been a factor as, again, it was applied and stripped over bare copper before ENIG. I sure appreciate the suggestion about FTIR. I'll employ the analysis process ASAP. Enjoy, MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------