Not to use was explained to me as such: No clean leaves a residue that with heat can reliquify and then start to move which will cause an air bubble where the flux was originally at and now isn't.
So the question comes to: does and at what temperature would it take for the no clean residue you are using to reliquify if it does at all? Then if it does liquify is there any activation that is occurring? Does the coating withstand the proper adhesion for the application if the air bubble does occur?
Kathy
<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN">
<HTML><HEAD>
<META http-equiv=Content-Type content="text/html; charset=iso-8859-1">
<META content="MSHTML 6.00.2713.1100" name=GENERATOR></HEAD>
<BODY style="MARGIN-TOP: 2px; FONT: 10pt MS Sans Serif; MARGIN-LEFT: 2px">
<DIV>Not to use was explained to me as such: No clean leaves a residue that
with heat can reliquify and then start to move which will cause an air bubble
where the flux was originally at and now isn't. </DIV>
<DIV> </DIV>
<DIV>So the question comes to: does and at what temperature would it take
for the no clean residue you are using to reliquify if it does at all?
Then if it does liquify is there any activation that is occurring? Does
the coating withstand the proper adhesion for the application if the air bubble
does occur? </DIV>
<DIV> </DIV>
<DIV> </DIV>
<DIV>Kathy </DIV></BODY></HTML>
