Jeff
Are you sure it's the laminate side of the copper? With reverse-treat
foils, the tooth side may be adjacent to the prepreg bonding sheets rather
than the laminate.
> ----------
> From: Foote, Jeffery[SMTP:[log in to unmask]]
> Reply To: TechNet E-Mail Forum.;Foote, Jeffery
> Sent: Thursday, February 14, 2002 8:18 AM
> To: [log in to unmask]
> Subject: Re: [TN] Delamination
>
> Rudy, You are correct the boards do not have buried vias, but the
> delamination does not necessarily locate adjacent to a hole. Tests on
> bare
> boards showed that they do occur primarily at one end of the PWB on layer
> 5
> of 8. The delaminations occur on the "sawtooth" side of the copper.
> Additionally, examination through the laminate on the secondary side
> (layer
> 8) revealed black patchy areas over large land patterns or ground planes
> on
> layer 7. These also occur on the sawtooth side of the copper. Although
> these areas have not delaminated, I have confirmed that the laminate resin
> does not bond to these areas and EDS showed the same presence of sulfur
> and
> tin that was observed on the delaminated surfaces. Do you know what
> chemical preparation the sawtooth side of the copper is exposed to in
> order
> to improve adhesion?
>
> Thanks Rudy for your time.
> Best Regards,
> Jeff
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Wednesday, February 13, 2002 3:33 PM
> To: [log in to unmask]
> Subject: [TN] Delamination
>
>
> In a message dated 2/13/02 2:58:07 PM Pacific Standard Time,
> [log in to unmask]
> writes:
>
> << I am looking for some information regarding the preparation of copper
> foil
> for adhesion to internal laminate layers in the construction of PWBs. I
> am
> presently experiencing delamination of the copper from the laminate
> prepreg
> on an internal layer after IR reflow exposure. EDS of the delaminated
> surfaces showed localized, high-concentration of sulfur and tin on the
> copper surface >>
>
> Jeff: I assume that this delamination is occuring adjacent to drilled
> holes?
> These are not buried via boards are they?
>
> Rudy Sedlak
> RD Chemical Company
>
> --------------------------------------------------------------------------
> --
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send e-mail to [log in to unmask]:
> SET
> Technet NOMAIL
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
> --
> -----
>
>
> The information contained in this email message may be privileged and is
> confidential information intended only for the use of the recipient, or
> any
> employee or agent responsible to deliver it to the intended recipient. Any
> unauthorized use, distribution or copying of this information is strictly
> prohibited and may be unlawful.
>
> If you have received this communication in error, please notify the sender
> immediately and destroy the original message and all attachments from your
> electronic files.
>
> --------------------------------------------------------------------------
> -------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send e-mail to [log in to unmask]:
> SET Technet NOMAIL
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
> -------
>
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
