In a message dated 2/13/02 2:58:07 PM Pacific Standard Time, [log in to unmask]
writes:

<< I am looking for some information regarding the preparation of copper foil
 for adhesion to internal laminate layers in the construction of PWBs.  I am
 presently experiencing delamination of the copper from the laminate prepreg
 on an internal layer after IR reflow exposure.  EDS of the delaminated
 surfaces showed localized, high-concentration of sulfur and tin on the
 copper surface >>

Jeff:  I assume that this delamination is occuring adjacent to drilled holes?
 These are not buried via boards are they?

Rudy Sedlak
RD Chemical Company

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