In a message dated 2/13/02 2:58:07 PM Pacific Standard Time, [log in to unmask] writes: << I am looking for some information regarding the preparation of copper foil for adhesion to internal laminate layers in the construction of PWBs. I am presently experiencing delamination of the copper from the laminate prepreg on an internal layer after IR reflow exposure. EDS of the delaminated surfaces showed localized, high-concentration of sulfur and tin on the copper surface >> Jeff: I assume that this delamination is occuring adjacent to drilled holes? These are not buried via boards are they? Rudy Sedlak RD Chemical Company --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------