Hello Anyone,

I am looking for some information regarding the preparation of copper foil
for adhesion to internal laminate layers in the construction of PWBs.  I am
presently experiencing delamination of the copper from the laminate prepreg
on an internal layer after IR reflow exposure.  EDS of the delaminated
surfaces showed localized, high-concentration of sulfur and tin on the
copper surface.  What types of chemistry or processes are used for the
preparation of the copper surface before bonding to the laminate.  The
delamination is occurring between the electroplated copper and the laminate.

Best Regards
Jeff Foote


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