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February 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 28 Feb 2002 08:57:26 -0600
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Mike,

I really appreciate your situation. I've just never even thought of doing it
the way you describe. Glad it works for you to a point.

Instead of doing real work in board shops anymore, I just kind of hang
around during evaluation and qualification processes. All I see is pretty
standard stuff using vacuum presses, or not, preg punches, with attendant
hardware as caul plates, separatory sheets, release materials, thermal lag
materials, tooling pins, details precisely aligned via the pins, and prepreg
slotted to float during the relamination process.

I'm not being sarcastic, but is there a reason you're not doing the above?
Again, I might be out of touch but I've recently worked with 52 and 40 layer
boards with relative ease and good quality/yields when the right design
rules are applied and processes are managed effectively. I, and many others,
during the military days 20 plus years ago were doing many designs over 24
layers even up to 60 in a few cases.

Wish I could help more, but I feel I'm missing something.

Enjoy,


Earl

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