Mike, I really appreciate your situation. I've just never even thought of doing it the way you describe. Glad it works for you to a point. Instead of doing real work in board shops anymore, I just kind of hang around during evaluation and qualification processes. All I see is pretty standard stuff using vacuum presses, or not, preg punches, with attendant hardware as caul plates, separatory sheets, release materials, thermal lag materials, tooling pins, details precisely aligned via the pins, and prepreg slotted to float during the relamination process. I'm not being sarcastic, but is there a reason you're not doing the above? Again, I might be out of touch but I've recently worked with 52 and 40 layer boards with relative ease and good quality/yields when the right design rules are applied and processes are managed effectively. I, and many others, during the military days 20 plus years ago were doing many designs over 24 layers even up to 60 in a few cases. Wish I could help more, but I feel I'm missing something. Enjoy, Earl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------