The paste's purpose is to reach up and grab the BGA balls, just as does
solder paste. Some folks already have said they simply spread a dolup of
paste over the BGA area. I still like the micro stenci's ability to deposit
a similar paste flux volume as that of the solder paste.
The key is compliance. If a BGA ball does not become in contact with
something warm and wet, it will not solder.
MoonMan
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