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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 12 Feb 2002 09:41:47 -0800 |
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Clipped from the referenced PCFab site
http://www.pcfab.com/db_area/archive/2002/0202/toc.html ]
"A Key Failure Mode Resulting in Interfacial Fracture of Soldered ENIG
Surfaces" Ken Crouse and Don Cullen, PCFab, Feb 2002, V 25, No 2, p. 22-32
"Black-line nickel, a low-level defect of electroless nickel immersion gold,
goes undetected prior to assembly yet results in improperly formed solder
joints, causing opens. Here's how the phenomenon - often associated with
soldermask - occurs, and how to prevent it."
Dave Fish
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