Clipped from the referenced PCFab site http://www.pcfab.com/db_area/archive/2002/0202/toc.html ] "A Key Failure Mode Resulting in Interfacial Fracture of Soldered ENIG Surfaces" Ken Crouse and Don Cullen, PCFab, Feb 2002, V 25, No 2, p. 22-32 "Black-line nickel, a low-level defect of electroless nickel immersion gold, goes undetected prior to assembly yet results in improperly formed solder joints, causing opens. Here's how the phenomenon - often associated with soldermask - occurs, and how to prevent it." Dave Fish --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------