I am interested in hearing others views in regard to allowing the wave
soldering process to fill the vias with solder or tenting the vias with
soldermask and how this relates to reliability.

I am seeing more and more designs with the vias covered.  Wouldn't
allowing the vias to fill with solder increase the reliability of the
PCA?  Or is this a matter of covering for the "sins" of the bare board
manufacturer's plating process?  Expecting .001" but getting
.0007-.0008" copper plating.

Should via's be left uncovered?

Respectfully

Paul


--
Paul Truit, Mfg. Eng.
RBB Systems, Inc.
4265C E. Lincolnway
Wooster, OH  44691
Ph. (330) 567-2906 ext 514
Fax (330) 263-5324
Email: [log in to unmask]

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