I am interested in hearing others views in regard to allowing the wave soldering process to fill the vias with solder or tenting the vias with soldermask and how this relates to reliability. I am seeing more and more designs with the vias covered. Wouldn't allowing the vias to fill with solder increase the reliability of the PCA? Or is this a matter of covering for the "sins" of the bare board manufacturer's plating process? Expecting .001" but getting .0007-.0008" copper plating. Should via's be left uncovered? Respectfully Paul -- Paul Truit, Mfg. Eng. RBB Systems, Inc. 4265C E. Lincolnway Wooster, OH 44691 Ph. (330) 567-2906 ext 514 Fax (330) 263-5324 Email: [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------