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Subject:	Re: To form or not to Form
From:	Guy Ramsey <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 12 Dec 2001 10:35:34 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (48 lines)

I did not see any one mention the fact that the leads of this component are
passing through a seal that is intended to keep an electrolyte inside the
component. Stressing the seal in this manner is unacceptable. It will very
likely cause the component to fail prematurely.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Andre Leclair
> Sent: Wednesday, December 12, 2001 8:26 AM
> To: [log in to unmask]
> Subject: [TN] To form or not to Form
>
>
> Hi all
> I hope this gets some good advice.
>
> I have a customer who is requiring the placement of an electrolitic cap
> that has a lead spacing of 0.140" and the PCB has 0.100".  They
> do not want
> the leads formed, they want the part flat to the board.  In doing this, am
> I opening myself up to stress induced failures of the component.
>
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