1. e. all of the above.
     I profile all these locations to ensure the desired temperature is
reached and to expose any  unseen problem areas.
     Use the clamp-on TC’s (Saunders  from Datapaq) for everything except
buried in solder.  (Kinda’ messy on expensive TC’s)
2. a.
3. a+b
I check the maximum temperature and duration for new components.  In
developing my profile, I have considered this information.  The target Time
Above Liquidus (TAL) is 60 seconds.  The actual time may vary, based on
population, ramp rate (available soak time), necessary through-put,
complexity of the PCB AND the oven I am using. (short oven vs. long oven)
The TAL never exceeds 90 seconds
The manufacturers spec for the solder is also part of the profile
consideration.


Richard Elensky
Sr. Manufacturing Engineer
[log in to unmask]

Tel:  559-292-1111  x246
Fax:  559-292-9355

Dantel
2991 North Argyle Ave.
Fresno, CA, 93727
Visit our web site at:
http:// www.dantel.com

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