Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 4 Oct 2001 14:01:40 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
To improve our wetting, we had to raise the temperature at a steeper rate,
to a higher peak. We were using an Omniflo-5 w/o N2. We created a
ramp-spike type of profile with the peak temperature measured at 230°C. The
wetting improved. The joints will never represent the text book definition
of a good joint. Ours were results generally good.
Richard Elensky
Sr. Manufacturing Engineer
[log in to unmask] <mailto:[log in to unmask]>
Tel: 559-292-1111 x246
Fax: 559-292-9355
Dantel
2991 North Argyle Ave.
Fresno, CA, 93727
Visit our web site at:
http:// www.dantel.com <http://www.dantel.com>
----------
From: Kevin Stokes [SMTP:[log in to unmask]]
Sent: Thursday, October 04, 2001 1:43 PM
To: [log in to unmask]
Subject: [TN] Palladium solderability problems
Everyone,
We are recently having some issues with a G sensor getting adequate
solderability to the palladium leads.
We have looked at the reflow profiles and temps and times look good.
Any ideas what I should look at next to get a grip on this problem?
As always, your help is appreciated.
Kevin
Kevin Stokes
Reliability Manager
Kimball Electronics Group
(812) 634-4207
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|