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October 2001

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IPC New Releases <[log in to unmask]>
Subject:
IPC New Release: IPC-TR-486, Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
From:
Joe Dudeck <[log in to unmask]>
Date:
Thu, 25 Oct 2001 14:56:10 -0500
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Joe Dudeck <[log in to unmask]>
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