IPC-TR-486, Report on Round Robin Study to Correlate
Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations
for Detecting the Presence of Inner-layer Separations
This technical report provides full detail of the round robin
study charged with assessing the use of Interconnect Stress Test (IST) as a test
for incoming inspection in lieu of Thermal Stress in the detection of innerlayer
separations in plated-through holes. Includes background on the Post Separation
Task Group, test results, round robin test plan, conclusions and test methods
used. 51 pages.
To order online, please visit:
http://webvision.ipc.org/scripts/mgrqispi.dll?APPNAME=IPCWEB&PRGNAME=ABSTRACT&ARGUMENTS=-N0,-N0,-A,-APRODLIST,-N50,-A,-ATR-486,-A,-ATR-486%20-%20Report%20on%20Round%20Robin%20Study%20to%20Correlate%20IST%20&%20Microsectioning%20Evaluations%20for%20Inner-Layer%20Separatio,-A,-A
To see a list of the latest releases,
-click on "Calalog/Bookstore"
-click on "New Releases"
Hardcopy Member Price:
$45 Hardcopy Non-Member
Price: $90
Electronic Member Price:
$68 Electronic Non-Member
Price: $136
To order by:
Phone: 847-790-5362
Fax: 847-509-9819