Barry,
Basically the reference was regarding PCB layout for BGA packages and some
testing that was done on 'dog-bone' fanout vs via-in-pad technology.
Rick
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Barry Gallegos
Sent: Tuesday, September 04, 2001 8:45 AM
To: [log in to unmask]
Subject: Re: [TN] Cap-plate Via-in-Pad??
What is the purpose of this?
Barry Gallegos
Process Engineer
Western Electronics
1550 S. Tech Lane
Meridian, Idaho, 83642
P- 208.955-9771
F- 208.955-9755
-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: Tuesday, September 04, 2001 9:01 AM
To: [log in to unmask]
Subject: Re: [TN] Cap-plate Via-in-Pad??
This was probably referring to a filled via that was copper plated over the
top, resulting in what appears like a round, solid pad. We use this design
quite often.
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
-----Original Message-----
From: Rick Thompson [SMTP:[log in to unmask]]
Sent: Tuesday, September 04, 2001 10:40 AM
To: [log in to unmask]
Subject: [TN] Cap-plate Via-in-Pad??
Hi,
I was doing some reading over the weekend and came across a
reference I
wasn't familiar with that said:
"Note that a filled and cap-plate via-in-pad construction was
used".
Can someone enlighten me as to what 'filled and cap-plate
via-in-pad' is?
Thanks,
Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065
+1 (805) 584-9858 x-304 voice
+1 (805) 584-1529 fax
[log in to unmask]
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