Barry, Basically the reference was regarding PCB layout for BGA packages and some testing that was done on 'dog-bone' fanout vs via-in-pad technology. Rick -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Barry Gallegos Sent: Tuesday, September 04, 2001 8:45 AM To: [log in to unmask] Subject: Re: [TN] Cap-plate Via-in-Pad?? What is the purpose of this? Barry Gallegos Process Engineer Western Electronics 1550 S. Tech Lane Meridian, Idaho, 83642 P- 208.955-9771 F- 208.955-9755 -----Original Message----- From: Marsico, James [mailto:[log in to unmask]] Sent: Tuesday, September 04, 2001 9:01 AM To: [log in to unmask] Subject: Re: [TN] Cap-plate Via-in-Pad?? This was probably referring to a filled via that was copper plated over the top, resulting in what appears like a round, solid pad. We use this design quite often. Jim Marsico Senior Engineer Production Engineering EDO Electronics Systems Group [log in to unmask] <mailto:[log in to unmask]> 631-595-5879 -----Original Message----- From: Rick Thompson [SMTP:[log in to unmask]] Sent: Tuesday, September 04, 2001 10:40 AM To: [log in to unmask] Subject: [TN] Cap-plate Via-in-Pad?? Hi, I was doing some reading over the weekend and came across a reference I wasn't familiar with that said: "Note that a filled and cap-plate via-in-pad construction was used". Can someone enlighten me as to what 'filled and cap-plate via-in-pad' is? Thanks, Rick Thompson Ventura Electronics Assembly 2655 Park Center Dr. Simi Valley, CA 93065 +1 (805) 584-9858 x-304 voice +1 (805) 584-1529 fax [log in to unmask] ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------