Input Needed !

We currently use a board that is designed for gold ball bonding (COB)
and have specified  electroplated gold as the top metal layer.  This
board also uses a Tayio solder mask material that is flood coated over
the top, including the gold pads then photo imaged/etched. to expose
specific gold pads for wire bonding.    My concern is that the solder
mask may be leaving some type of contamination on the bonding pads.   If
so, I'm looking for recommendations on how to verify cleanliness, other
than ionically (which we do) and how to remove any contamination.


Thanks,

Bill C. 

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