Input Needed ! We currently use a board that is designed for gold ball bonding (COB) and have specified electroplated gold as the top metal layer. This board also uses a Tayio solder mask material that is flood coated over the top, including the gold pads then photo imaged/etched. to expose specific gold pads for wire bonding. My concern is that the solder mask may be leaving some type of contamination on the bonding pads. If so, I'm looking for recommendations on how to verify cleanliness, other than ionically (which we do) and how to remove any contamination. Thanks, Bill C. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------