Jana, I may attract a lot of flack, but my guru's know who they are and
will correct me if I've come to the wrong conclusions. My understanding is
that 150 microinches (approx 4 microns) Nickel is not sufficient any more
to shield the solder joints form undesirable intermetallic compounds coming
through from the copper layer, and that 6 microns (235 microinches) should
be considered for normal specification. There is also some debate as to
whether or not 5 microinches Au is sufficient to prevent
passivation/oxidisation of the Nickel plating.
I throuw my hat into the ring and wait for someone to stomp on it.
Regards
Pete Duncan
"Jana L.
Carraway" To: [log in to unmask]
<carrawayj@BIOT cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
RONIK.COM> Subject: Re: [TN] Easy Thursday Question!
Sent by:
TechNet
<[log in to unmask]
G>
08/17/01 02:06
AM
Please respond
to "TechNet
E-Mail Forum."
Thank you Brent!
I see that engaging typing fingers before engaging brain is not a good
idea!
Should have had my Starbuck's coffee before hitting the keys this AM! I
was
typing an electroless nickel question and thinking immersion gold chemisty.
What I should have asked is:
What is the typical electroless deposition thickness specified for
electroless nickel/immersion gold for SMT application? Does this vary with
the class of board being produced; class 3 requires tighter tolerance or
some set minimum, etc.
Thank you for your input,
Jana Carraway
Micro Systems Engineering, Inc.
Lake Oswego, Oregon
503-635-4016 ext 1180
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Alcorn, Brent
Sent: Thursday, August 16, 2001 10:01 AM
To: [log in to unmask]
Subject: Re: [TN] Easy Thursday Question!
If this is for a final gold plating then we typically call out 50 to 150
micro inches for electroless nickel and then 3 to 8 micro inches of
immersion gold.
Regards,
Brent
-----Original Message-----
From: Jana L. Carraway [mailto:[log in to unmask]]
Sent: Thursday, August 16, 2001 12:20 PM
To: [log in to unmask]
Subject: [TN] Easy Thursday Question!
As we do not do manufacturing at this site, I have no technical data sheets
handy - so I need to ask a quick and easy question! (I haven't found the
answer on supplier's websites and have a couple calls into suppliers, but
you know how long that can take to get feedback - just kidding guys, I know
everyone is busy these days)
My question is: What is the typical electroless nickel deposition
thickness?
I'm thinking it's around 3-5 microns. Is that correct? What range is
given
on the technical literature from suppliers, if any of you guys has a tech
data sheet handy?
Thank you for your help!
Jana Carraway
Micro Systems Engineering, Inc.
Lake Oswego, Oregon
503-635-4016 ext 1180
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