Jana, I may attract a lot of flack, but my guru's know who they are and will correct me if I've come to the wrong conclusions. My understanding is that 150 microinches (approx 4 microns) Nickel is not sufficient any more to shield the solder joints form undesirable intermetallic compounds coming through from the copper layer, and that 6 microns (235 microinches) should be considered for normal specification. There is also some debate as to whether or not 5 microinches Au is sufficient to prevent passivation/oxidisation of the Nickel plating. I throuw my hat into the ring and wait for someone to stomp on it. Regards Pete Duncan "Jana L. Carraway" To: [log in to unmask] <carrawayj@BIOT cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group) RONIK.COM> Subject: Re: [TN] Easy Thursday Question! Sent by: TechNet <[log in to unmask] G> 08/17/01 02:06 AM Please respond to "TechNet E-Mail Forum." Thank you Brent! I see that engaging typing fingers before engaging brain is not a good idea! Should have had my Starbuck's coffee before hitting the keys this AM! I was typing an electroless nickel question and thinking immersion gold chemisty. What I should have asked is: What is the typical electroless deposition thickness specified for electroless nickel/immersion gold for SMT application? Does this vary with the class of board being produced; class 3 requires tighter tolerance or some set minimum, etc. Thank you for your input, Jana Carraway Micro Systems Engineering, Inc. Lake Oswego, Oregon 503-635-4016 ext 1180 -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Alcorn, Brent Sent: Thursday, August 16, 2001 10:01 AM To: [log in to unmask] Subject: Re: [TN] Easy Thursday Question! If this is for a final gold plating then we typically call out 50 to 150 micro inches for electroless nickel and then 3 to 8 micro inches of immersion gold. Regards, Brent -----Original Message----- From: Jana L. Carraway [mailto:[log in to unmask]] Sent: Thursday, August 16, 2001 12:20 PM To: [log in to unmask] Subject: [TN] Easy Thursday Question! As we do not do manufacturing at this site, I have no technical data sheets handy - so I need to ask a quick and easy question! (I haven't found the answer on supplier's websites and have a couple calls into suppliers, but you know how long that can take to get feedback - just kidding guys, I know everyone is busy these days) My question is: What is the typical electroless nickel deposition thickness? I'm thinking it's around 3-5 microns. Is that correct? What range is given on the technical literature from suppliers, if any of you guys has a tech data sheet handy? Thank you for your help! Jana Carraway Micro Systems Engineering, Inc. Lake Oswego, Oregon 503-635-4016 ext 1180 ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------