TECHNET Archives

August 2001

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Content-Type:
multipart/alternative; boundary="----=_NextPart_000_002E_01C12956.71C581A0"
Sender:
TechNet <[log in to unmask]>
Subject:
Re: Assemblies using ceramic substrates...
From:
Mike Fenner <[log in to unmask]>
Date:
Mon, 20 Aug 2001 08:59:38 +0100
In-Reply-To:
<[log in to unmask]>
MIME-Version:
1.0
Reply-To:
[log in to unmask]
Parts/Attachments:
text/plain (2594 bytes) , text/html (4 kB)

ATOM RSS1 RSS2