Hi, Everyone,

We are working on a conduction-cooled VME SMT board design for an avionics
application. It requires a 7 degree C thermal gradient from Chip die at the
board centre to card the edge, which may be impossible, but we're trying so
I need your advice.

I'm looking for a highly efficient thermal material 0.30mm thick +/- 0.03mm
and a material 0.15mm thick +/- 0.03mm to fill component air gaps and other
material interfaces. It should have double-sided adhesive, and require an
absolute minimum attachment pressure.

I cannot find any materials anywhere, myself, that aren't 0.25mm or 0.5mm
or thicker. And there's nothing as thin as 0.15 finished thickness even in
thermal tapes. We don't want to use greases or anything silicone either.

Any ideas, anyone, as to where I might find a material souce to meet such
requirements?

TIA for your ever-wonderful ideas.

Pete Duncan

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