Hi, Everyone, We are working on a conduction-cooled VME SMT board design for an avionics application. It requires a 7 degree C thermal gradient from Chip die at the board centre to card the edge, which may be impossible, but we're trying so I need your advice. I'm looking for a highly efficient thermal material 0.30mm thick +/- 0.03mm and a material 0.15mm thick +/- 0.03mm to fill component air gaps and other material interfaces. It should have double-sided adhesive, and require an absolute minimum attachment pressure. I cannot find any materials anywhere, myself, that aren't 0.25mm or 0.5mm or thicker. And there's nothing as thin as 0.15 finished thickness even in thermal tapes. We don't want to use greases or anything silicone either. Any ideas, anyone, as to where I might find a material souce to meet such requirements? TIA for your ever-wonderful ideas. Pete Duncan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------