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May 2001

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 May 2001 08:32:34 -0400
Content-Type:
text/plain
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text/plain (95 lines)
We're using water in a polypropylene sink with a high pressure hose to clean
mis-prints and the stencils.  This sink is tied in to our in-line aqueous
cleaner and closed loop waste treatment system.  The incoming water to the
sink comes from the pre-wash (dirtiest) section of our in-line cleaner, and
the waste, after going through a particulate filter to remove solder powder,
goes to the waste treatment system and is returned to the in-line cleaner.
This works very well.

Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
[log in to unmask] <mailto:[log in to unmask]>

        -----Original Message-----
        From:   bbarr [SMTP:[log in to unmask]]
        Sent:   Thursday, May 03, 2001 8:18 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] Unusual Cleaning Operation- Help!

        Your comments about ultrasonics has got me thinking- I am looking
for a new
        stencil cleaner that would also be used for cleaning misprinted
boards. I am
        using water-soluble paste. The stencil cleaners I see on the market
today
        all seem to employ ultrasonics. Since many of our boards use
crystals,
        oscillators, etc., I am concerned about subjecting them to
ultrasonics if I
        have to clean a misprint on side 2 of the board after side 1 is
completed. I
        am wondering what others in a similar situation are using as a
        stencil/misprint cleaner for water-soluble.


        Bob


        Robert Barr
        Manufacturing Engineering
        Formation, Inc.


        -----Original Message-----
        From: TechNet [mailto:[log in to unmask]]On Behalf Of Brian Ellis
        Sent: Thursday, May 03, 2001 2:43 AM
        To: [log in to unmask]
        Subject: Re: [TN] Unusual Cleaning Operation- Help!


        Brian wrote: (snipped)

        Ultrasonics: before adopting ultrasonics in production, check the
        reliability of cleaned assemblies. There are some components that
don't
        like them at all. Especially ceramic-cased semiconductors, quartz
        crystals, some multilayer ceramic capacitors etc. The problem is
that
        they may not cause the component to fail in the immediate but to
weaken
        it so that it fails prematurely after a number of
        days/weeks/months/years of service.


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