this is the cutest stuff I have heard.
really innovative. my nomination for the award.
Anil Kher
----- Original Message -----
From: "Jeff Ferry" <[log in to unmask]>
Sent: Wednesday, May 02, 2001 6:26 PM
Subject: Re: Plating up Gold Tabs
> Mike,
>
> Adding to the response from Sherman. We've attempted many time to build up
> thickness in the contact area by off line plating. We're not a board
> fabricator so it has always been the brush plating/swab plating process.
> You may be able to build up .0005", but we've found adding .002" is
> difficult, if not nearly impossible.
>
> This may sound off beat but we've had great success using a mechanical
> process. We fixture the board on a milling machine and saw into the center
> of the PCB edge the full depth of the contacts using a thin (.010") thick
> mounted saw. We then insert and epoxy in place a wedge of circuit board
> material (.012") thick to expand the area. Due to the cost it's not likely
> worth it on the bare, or panel boards, but may be worth considering on
> loaded boards.
>
> May seem a bit wild and crazy but it works well.
>
> Jeff Ferry
> CEO
> Circuit Technology Center
> www.circuittechctr.com
> [log in to unmask]
>
> On Tue, 1 May 2001 18:49:15 -0400, Doty, Mike <[log in to unmask]>
wrote:
>
> >Sherman,
> > First thing to do is to see if you have electrical connection to
> all
> >the fingers in the circuit. That is to say a buss bar or internal bussing
> >that will allow electroplating. I'm guessing these were fab'd outside. If
> >so, the final routing will have broken connection across the fingers. If
> not
> >then stripping the Ni/Au and plating up the copper may be your best
> >recourse. I'm not sure about how 2 mils of copper plating is going to
work
> >electrically for you amongst other things.
> > Electroless plating may not work as the gold plating must be hard
> >gold on the fingers. Immersion gold isn't and you can't plate up to the
> gold
> >thickness you require. Just my 2 cents.
> >
> > Mike Doty
> > P.E.
> >-----Original Message-----
> >From: Sherman Banks [mailto:[log in to unmask]]
> >Sent: Tuesday, May 01, 2001 6:09 PM
> >To: [log in to unmask]
> >Subject: [TN] Plating up Gold Tabs
> >
> >
> >Hello everyone,
> >We have an interesting situation. We have product that is too thin to
meet
> >our card edge connector specification by about 2 mils. We need to build
up
> >these gold tabs by at least one mil (0.001") on each side of the board.
The
> >tabs are now approx one ounce copper with 200 micro inches of nickel and
30
> >micro inches of gold. Thoughts were to build up gold with electroless, or
> >strip gold/nickel, plate up copper, then replate nickel and gold. Has
> anyone
> >ever come across this sort of situation before? Any ideas? Note: Some of
> >this product is on panel format, some single boards, and some loaded
> boards.
> >
> >Thanks in Advance
> >
> >Regards,
> >Sherman Banks
> >Finisar Corp.
> >1308 Moffett Park Drive
> >Sunnyvale, CA 94089
> >408/542-4240
> >[log in to unmask]
> >
>
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