Howdy,

I have got a major mess on my hands.  We may soon be running a double sided
SMT product that needs to be fully cleaned due to a conformal coating
process.
Both sides of the assembly have two 2" x 1" x .3" RF Shields that are
soldered to the PCA.  There are SMT components under the shield, and the
shields have two .040" holes on top- the rest of the shield is sealed.
Just in case we cannot clean 100% of the residue out of these shields, the
customer requires a no-clean chemistry solder paste.  (They claim no clean
residue has caused problems with past due to issues with the battery
pack...I am not much of an electrical guy, and cannot refute them).
They are pushing us towards a vapor degrease cleaning method, since they
had used the process sucessfully during the design phase with good luck.

Question 1: If we did use a non aqueous solvent for cleaning, especially
one that has evaporative characteristics (any HCFC replacement), could we
avoid the "bake out" process?

Question 2: Would a cold soak process with somthing like Bioact be a viable
alternative- and be performed without a bake out?

Question 3: Would ultrasonics be valuable (if we had alternating frequency
such as with the Smartsonic system), or could more damage be done.

Steve Abrahamson
208-898-2695
[log in to unmask]

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