Hi Guys,
The internal stress of the Ni and most importantly the thickness will
determine if it stands up to deformation. Any data on in service/assembly
stress/strains??
Regards,
Ken Mc Gowan
----- Original Message -----
From: "Chuck Brummer" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, May 24, 2001 9:42 PM
Subject: Re: [TN] ENIG in flex layers
> Steve,
> Not necessarily. It depends on the tension of the nickel. A well
controlled nickel bath will
> not yield brittle circuits.
> Chuck Brummer
>
> Steve Kelly wrote:
>
> > If the nickel is on the copper trace under the covercoat in a bend area
you
> > are in trouble. Steve Kelly
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]]On Behalf Of Jindra, Larry
> > Sent: Thursday, May 24, 2001 3:16 PM
> > To: [log in to unmask]
> > Subject: [TN] ENIG in flex layers
> >
> > Our rigid/flex vendor deposited immersion gold over electroless nickel
on
> > internal 1 oz copper flex layers prior to lamination of a
rigid-flex-rigid
> > board. Our intent was to have ENIG finish only on the exposed connector
> > pads on the one end of the rigid/flex (6 layers). Instead, the ENIG is
on
> > the pads, on the flex, and continues on in internal to the other rigid
> > portion of the circuit board (10 layers).
> >
> > I have concerns about the durability of the flex and the via stackup in
the
> > 10 layer rigid section, which now has nickel on layers 3 & 8. Am I just
> > paranoid, or am I in trouble?
> >
> > > Larry Jindra
> > > mailto:[log in to unmask] ph (858) 592-3424 fax (858) 592-3940
> > >
> >
>
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