Steve,
Not necessarily.  It depends on the tension of the nickel.  A well controlled nickel bath will
not yield brittle circuits.
Chuck Brummer

Steve Kelly wrote:

> If the nickel is on the copper trace under the covercoat in a bend area you
> are in trouble. Steve Kelly
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Jindra, Larry
> Sent: Thursday, May 24, 2001 3:16 PM
> To: [log in to unmask]
> Subject: [TN] ENIG in flex layers
>
> Our rigid/flex vendor deposited immersion gold over electroless nickel on
> internal 1 oz copper flex layers prior to lamination of a rigid-flex-rigid
> board.  Our intent was to have ENIG finish only on the exposed connector
> pads on the one end of the rigid/flex (6 layers).  Instead, the ENIG is on
> the pads, on the flex, and continues on in internal to the other rigid
> portion of the circuit board (10 layers).
>
> I have concerns about the durability of the flex and the via stackup in the
> 10 layer rigid section, which now has nickel on layers 3 & 8.  Am I just
> paranoid, or am I in trouble?
>
> > Larry Jindra
> > mailto:[log in to unmask]   ph (858) 592-3424   fax (858) 592-3940
> >
>
> ----------------------------------------------------------------------------
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> ----------------------------------------------------------------------------
> -----
>
> ---------------------------------------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> ---------------------------------------------------------------------------------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------