Our rigid/flex vendor deposited immersion gold over electroless nickel on internal 1 oz copper flex layers prior to lamination of a rigid-flex-rigid board.  Our intent was to have ENIG finish only on the exposed connector pads on the one end of the rigid/flex (6 layers).  Instead, the ENIG is on the pads, on the flex, and continues on in internal to the other rigid portion of the circuit board (10 layers).

I have concerns about the durability of the flex and the via stackup in the 10 layer rigid section, which now has nickel on layers 3 & 8.  Am I just paranoid, or am I in trouble?

> Larry Jindra
> mailto:[log in to unmask]   ph (858) 592-3424   fax (858) 592-3940
>

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