Jason,

We repair dozens of assembled circuit boards every day by replacing damaged
BGA pads. We use replacement pads that have a dry film adhesive backing
that are thermally bonded in place. We've been using this IPC recommended
thermal bonding repair process for over 10 years on standard surface mount
pads. Although we've only been replacing BGA pads for a few years, the
process of replacing BGA pads is the same as replacing surface mount pads.

I suspect we may do this a bit more than most since we operate a contract
circuit board repair business. The key to this process is using a dry film
adhesive vs. a liquid epoxy to bond the new pad. You can see our online
procedure at http://www.circuittechctr.com/guides/4-7-3.htm. We also have a
few additional versions of the procedure where integral vias are involved.

Jeff Ferry
CEO
Circuit Technology Center
www.circuittechctr.com
[log in to unmask]



On Fri, 11 May 2001 13:13:39 -0400, Jason Cross <[log in to unmask]>
wrote:

>Technetters,
>I am aware that some people do repair BGA pads on PCB after component
>removal at rework.  I am also aware there are kits available with
>varying pad sizes and such.  My question is two parts:  Can anyone
>comment on how widespread this is done in the industry (particularly
>telecom), and which methods/techniques (if there are multiple?) are most
>common.  Has anyone performed any reliability assessment on these
>repaired pads?  Can they be as reliable as an original PCB pad solder
>joint?
>
>Any help/comments would be appreciated.
>Regards,
>
>Jason Cross
>Alcatel Canada Inc.
>
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