Hi There,
Just my input. Agree adhesion of electrolytic Sn can be due to poor
treatment between Ni plate and Sn. Best to use anodic dry acid salts 50 g/l,
25 C 25ASF and the normal combination of rinses etc. Also can be caused by
higher than normal organic content of either the Ni or Sn. Does the plater
control his additives properly?
Best Regards,
Ken McGowan
----- Original Message -----
From: "Crepeau, Phil" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, May 09, 2001 4:33 PM
Subject: Re: [TN] Weak solderJoint - Part easily peel-off on Ni200 material
> hi,
>
> in case you haven't gotten a response to your problem, here's what i
think. it's pretty well known that plating to passivated nickel will cause
what you have seen. consequently, platers need to take special precautions
to remove any passivation and then keep the nickel from passivating before
the overplating process. doesn't seem that your vendor is able to do that
consistently? you need to have a long talk with them.
>
> phil
>
> -----Original Message-----
> From: Lee PengSoon-CPL035 [mailto:[log in to unmask]]
> Sent: Tuesday, May 01, 2001 7:20 PM
> To: [log in to unmask]
> Subject: Re: [TN] Weak solderJoint - Part easily peel-off on Ni200
> material
>
>
> > Hi All,
> > I have problem to reflow thin plate (tab) of Ni200, the part easily
peeled-off (<1kgf) for the soldering area of 3mx2mm.
> > Not all the while I have such such problem. Only 20-50% of the certain
lot of nickel plate.
> > The Ni200 tab is tin platted elctrolitically, SEM check on the failure
surface reveal the below % weight of element.
> > At Component side,
> > Nickel 12.4 [15.8]
> > Sn 50.8 [51.95]
> > Pb 9.7 [9.11]
> > Cu 11.5 [10.3]
> >
> > At PCB pad side,
> > Nickel 4.8 [6.6]
> > Sn 63.4 [69.13]
> > Pb 12.5 [10.35]
> > Cu 8.4 [6.4]
> >
> > Composition of bad unit is [].
> >
> > Voids is relatively higher on the breaking surface of bad unit.
> > Shall I say that the plating adhesion is still good since the breaking
layer is not between tin plating to the Ni200 base material.
> > Manual soldering does not have such problem (peeling force >3.5Kgf).
> >
> > Need advise/help/recommendation on the further analysis to be carried
out.....
> >
> >
> >
> >
> >
> >
>
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