TECHNET Archives

May 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Phillip E. Hinton" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 May 2001 12:24:36 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
Gaby

I have had tin whiskers grow on tin coatings from 0.4 micron to 30 micron on
brass substrates (A few of the substrates were copper.)  I have never tested
coatings less than the 0.4 micron, but would expect with a little heat on the
very thin coatings that the tin would quickly have some contaminating metal
diffused in it and the whisker growth would be inhibited.  However, in a
report that I read somewhere it said that it could happen with about 5 tin
atoms of thickness or about 30 A (angstroms) or 3X10E-3 micron.  That is
pretty thin.

I have not tested the immersion/electroless tin process for whisker growth
and know only what I have read on Technet.

Phil Hinton

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2