Hi ya'll!!

Thanks for all the suggestions for chemicals to remove epoxy encapsulation
material.
I had some Uresolve 411 here, but that won't work. Our customer has sent some
parts to a failure analysis lab, and the vendor is doing some work on their
end too.

I was looking at the parts under a microscope holding it with tweezers, and
was gently scraping it with an x-acto knife, when the whole encapsulation
just popped off! It wasn't any force at all!

I got a few more parts and found that I could very easily separate the whole
glob off with hardly any force at all...like the encapsulation material
wasn't bonded well to the substrate. I took a picture, go to:

http://stevezeva.homestead.com/index.html

You see the wire in the epoxy, and the silver epoxy for the die...but as you
can see, the whole deal popped of very cleanly...are you supposed to be able
to do that? Any ideas?

-Steve Gregory-   <----Flak jacket is on in case he slips and makes a
joke...hehehe

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