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May 2001

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From:
"d. terstegge" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 8 May 2001 09:34:25 +0200
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Two weeks ago I had a similar problem, but it was with only one type of component. We first thought something was wrong with the glueing process or the adherence of the component-material. But it turned out to be the adjustment of the wave: the problem was only with the thickest components of these boards, and they just touched the nozzle. Readjustment of the wave-nozzle solved it.

Kind regards,

Daan Terstegge
Unclassified mail
Personal Website: http://www.smtinfo.net

>>> Becerra Alejandro <[log in to unmask]> 05/08 2:43 am >>>
Hello to All,
I have a question regarding to the adhesive used to hold SMD components
prior to wave soldering.
The problem consists in missing SMD components after wave soldering.
Is it possible that the components fell down during the wave soldering
process because of a high temperature of pre-heaters or solder?
Thanks in advance

Alejandro Becerra
Quality Assurance
(915)841-8439

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