Bob,
Based upon your requirements, you may want to acquire an oven from VWR
Scientific Products. You can also consult their website at:
http://www.vwrsp.com/.
Good Luck
Lee Whiteman
Senior Manufacturing Engineer
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x208
Fax: (610) 362-1290
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob Walker
> Sent: Wednesday, May 30, 2001 8:22 AM
> To: [log in to unmask]
> Subject: Re: [TN] Moisture Sensitive Components
>
>
> Does anyone have any recommendations for a small, inexpensive oven to bake
> IC's with? We're an ASIC design group and build/rework our own
> prototype PCB
> assemblies in small quantities and have decided that we need to be more
> cautious with how we deal with large IC's after they have been
> removed from
> the vacuum sealed bag and prior to reflowing them on PCB's.
>
> After the IC's have been initially removed from the bag, I keep any unused
> IC's in a plastic bag with the original bag of dessicant and humidity
> indicator which never seems to show any excessive amount of exposure to
> moisture. But these parts may not be put down on boards for a couple of
> months and a co-worker feels that they may still be absorbing enough
> moisture to be a potential candidate for "popcorning" even though the
> humidity indicator shows otherwise.
>
> A suggestion was made to just buy a "toaster oven" since we only
> deal with a
> few IC's at a time. Any comments, pro or con, with regards to this? Thanks
> in advance for any feedback.
>
> Regards,
> Bob Walker
> Sandgate Technologies Inc.
> [log in to unmask]
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Curtis Thompson
> Sent: Friday, May 25, 2001 11:08 AM
> To: [log in to unmask]
> Subject: Re: [TN] Moisture Sensitive Components
>
>
> A simple sealed oven (at 40C) that is purged with clean nitrogen is very
> effective (clean N does not carry H20)at getting rid of moisture
> and rather
> inexpensive.
>
> Curtis Thompson
> Extreme Networks Process Development Engineer
>
> -----Original Message-----
> From: Guy Ramsey [mailto:[log in to unmask]]
> Sent: Thursday, May 24, 2001 12:44 PM
> To: [log in to unmask]
> Subject: [TN] Moisture Sensitive Components
>
>
> Anyone out there ever considered dring moisture sensitive devices by
> lowering the pressure in a storage vessle?
>
> It is difficult to achieve 40°C and less than 5%RH when ambient
> RH is 50-60
> percent. So, someone called and asked how long he would need to keep the
> parts at a pressure equivelent of 80,000 ft above sea level,
> temperature at
> room ambient to dry out parts.
>
> No one here had considered it before. The physics made me feel
> like I was at
> altitude.
>
> Guy Ramsey
> Senior Lab Technician / Instructor
>
>
> E-Mail: [log in to unmask] <mailto:[log in to unmask]>
> Ph: (610) 362-1200 x107
> Fax: (610) 362-1290
>
> ------------------------------------------------------------------
> ----------
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> ------------------------------------------------------------------
> ----------
> -----
>
> ------------------------------------------------------------------
> ----------
> -----
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET
> Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases >
> E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> ------------------------------------------------------------------
> ----------
> -----
>
> ------------------------------------------------------------------
> ---------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following
> message: SET Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources &
> Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ------------------------------------------------------------------
> ---------------
>
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
