Technetters,
I am aware that some people do repair BGA pads on PCB after component
removal at rework.  I am also aware there are kits available with
varying pad sizes and such.  My question is two parts:  Can anyone
comment on how widespread this is done in the industry (particularly
telecom), and which methods/techniques (if there are multiple?) are most
common.  Has anyone performed any reliability assessment on these
repaired pads?  Can they be as reliable as an original PCB pad solder
joint?

Any help/comments would be appreciated.
Regards,

Jason Cross
Alcatel Canada Inc.

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