Technetters, I am aware that some people do repair BGA pads on PCB after component removal at rework. I am also aware there are kits available with varying pad sizes and such. My question is two parts: Can anyone comment on how widespread this is done in the industry (particularly telecom), and which methods/techniques (if there are multiple?) are most common. Has anyone performed any reliability assessment on these repaired pads? Can they be as reliable as an original PCB pad solder joint? Any help/comments would be appreciated. Regards, Jason Cross Alcatel Canada Inc. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------