Hi, Don,
I take it you're building either a mixed technology board, and/or are CR
soldering an SMT board followed by wave sodlering edge connectors. As
Werner says, as long as you achieve full melting point again, there should
be no problem, though with a no-clean process I might be concerned about
the lack of fluxing left to maintain good wetting. If you don't get
adequate wetting, you may get very course crystaline joints and de-wetting.
Is hand soldering a viable alternative to wave soldering, or are there too
many joints?
Regards
Pete Duncan
Asst Principal Engineer
ST Aerospace
Werner Engelmaier <[log in to unmask]>@IPC.ORG> on 03/17/2001 04:41:53 AM
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Subject: Re: [TN]
Hi Donn,
As long as the SJs completely liquefy in the second soldering process, no
reliability down-side exists--it is like a second reflow. I am not clear
why
you want to do this however.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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