You mean IPC-6012, right? Table 3-2 it sounds like. I don't see that
requirement listed in the IPC-A-600.
We're a fab, not an assembler, but I've heard of significant reliability
problems with holes having less than .0007 (18 micron) copper in them. I
would stick to the spec. (My $.02)
Tim Reeves

|-----Original Message-----
|From: Ashley Allen Shepard [mailto:[log in to unmask]]
|Sent: Friday, March 09, 2001 6:49 AM
|Subject: Exception to IPC-A-600 Class II minimum via wall plating
|
|
|Hi All,
|
|I'm wondering if anyone has data they'd be willing to share
|supporting the
|18 micron minimum (class I and II) Final Finish, Surface
|Plating Coating
|Requirements in the IPC-A-600 specification.  Specifically,
|I'm interested
|in the effects of reducing via wall plating thickness. Any information
|would be greatly appreciated.
|

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