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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 7 Mar 2001 20:22:08 EST |
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Hi "boardmanusa,"
You do not say what kind of BGA, whetherSMD or NSMD, how close the failures
are to the SJ interface. If good wetting has taken place ( failurs are not
interfacial) you may have SJ fractures due to thermal shock (=cooling too
rapid after reflow). The larger the component the worse this gets.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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