Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 19 Mar 2001 09:40:23 -0600 |
Content-Type: | multipart/mixed |
Parts/Attachments: |
|
|
I've been through the process. It really reduced the amount of solder skips on SOT-23 packages. We didn't have any issues with excessive joints or solder joints that didn't meet the IPC solder joint requirement. We put probably about 3 mils down in surface mount. We used it more as additional mechanical strength for handling through the though-hole assembly line processes. Watch your reflow profiles though we had a residue issue with the adhesive and the paste being liquid at the same time. The adhesive wasn't cured completely when the solder reflow started. We were a no-clean process also but the no clean flux embedded itself into the adhesive. It did cause problems with a few medical customers.
Kathy
<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN">
<HTML><HEAD>
<META content="text/html; charset=iso-8859-1" http-equiv=Content-Type>
<META content="MSHTML 5.00.2614.3500" name=GENERATOR></HEAD>
<BODY style="FONT: 8pt Arial; MARGIN-LEFT: 2px; MARGIN-TOP: 2px">
<DIV><FONT size=1>I've been through the process. It really reduced the
amount of solder skips on SOT-23 packages. We didn't have any issues with
excessive joints or solder joints that didn't meet the IPC solder joint
requirement. We put probably about 3 mils down in surface mount. We
used it more as additional mechanical strength for handling through the
though-hole assembly line processes. Watch your reflow profiles though we
had a residue issue with the adhesive and the paste being liquid at the same
time. The adhesive wasn't cured completely when the solder reflow
started. We were a no-clean process also but the no clean flux embedded
itself into the adhesive. It did cause problems with a few medical
customers. </FONT></DIV>
<DIV> </DIV>
<DIV><FONT size=1>Kathy</FONT></DIV>
<DIV> </DIV></BODY></HTML>
|
|
|