Hello Fellow Netters,

        Here's a recipe for a soldering nightmare.  We're developing a
process that involves the following materials, but not having very good
success with attaining an 'acceptable' solder joint.

        Lap soldering a .4 mil dia platinum wire to the top of a .040" dia
kovar post using indium solder (60% indium/40% lead).  Additional info:  the
kovar post has a nickel coat 200 micro inches, then 30 micro inches of hard
gold plating.

        One issue:  indium solder does not wet to tip of iron and platinum
wire (tip temp is at 670F)
        Second issue: If we use zinc chloride as a fluxing agent, the end
solder is better, but we would rather stay away from using this flux (too
corrosive).

        Does this challenge anyone out there?  We'd appreciate any and all
feedback.

Process Control Supervisor
[log in to unmask]
Industrial Scientific Corp.
www.indsci.com
voice  412.490.1884

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